16th ASEMEP NTS Highlights
P.IMES Corporation in cooperation with SEIPI, hosted the 16th ASEMEP National Technical Symposium.
The theme of this year's symposium is "
Sustaining Competitiveness Through Technical Vitality Towards A Strong Nation".
Said symposium featured the Technical Paper Writing Competition, ASEMEP learning sessions, the Mobots Competition, exhibit and the
Fellowship Night.
Winners for the Technical Paper Competition (per category) are as follows:
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Assembly Technology - "Thermal Degradation of UBM Adhesion in Wafer Level Chip Scale Package" by Jaime C. Punzalan, Jr. of Analog Devices Inc.
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Facilities - "Reduction of Wastewater Discharge through Reprocessing of Second-Pass Reverse Osmosis Brine Waste" by Jacqueline M. Quintos and Ireneo F. Cana, Jr. of Toshiba Information Equipment Inc.
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Manufacturing Technology (End of Line) - "Particle Buildup Analysis : Baseline for Establishing Tool Set Cleaning Frequency for SnPb Plated Leadframes for Solderability Failure Prevention" by Randy Y. Ursal of Fairchild Semiconductor.
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Manufacturing Technology (Front of Line) - "Bonder Fingerprinting : A Solution for Robust Ultra Low K with Ultra Fine In-Line Bond Pad Pitch Wirebonding" by Aileen M. Soriano, Marites L. Roque, Timer D. Porras & Rolando Delirio of Texas Instruments Philippines Inc.
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Product & Test Technology - "Improving RF Power Amplifier Performance through Bond Wire Loop Height Optimization" by Sundy L. Licuanan and Lloyd T. Sison of Philips Semiconductors Philippines Inc.
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Quality Systems - ESD - Failure Analysis & Reliability - "ESD Grounding Set-Up for Ground Noise and Leakage Current Protection" by Ray Nicanor M. Tag-at, Roger Galinggana, Jr. & Lloyd Henry I. Li of Hitachi Global Storage Technologies Corp.
There were nine (9) learning sessions conducted dealing with new or emerging technologies, systems and processes.
A new addition to this year's symposium was the well-received Mobots competition. Students from various schools participated in the Microcontroller Applications Design Contest (MADC) organized by IEEE Philippine Section and sponsored by Zilog Electronics Philippines, Inc.
P. IMES Special Award was awarded to Sundy L. Licuanan and Lloyd T. Sison from Philips Semiconductors Philippines Inc. with the technical paper entry entitled "Improving RF Power Amplifier Performance through Bond Wire Loop Height Optimization". The P.IMES Special Award was given to the Best Written Paper that substantiates Filipino engineers' global competence and commitment to technology innovation that aspire us for the next generation applications.
Next year's host will be Hitachi Global Storage Technologies Philippines Corporation.
