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| "WE MOUNT BOARDS FOR YOUR SATISFACTION" |
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PIMES do PCB assembly using Surface Mount Technology (SMT) utilizing lead free soldering and auto visual inspection.
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| Assembly Capabilities |
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SURFACE MOUNT TECHNOLOGY |
CHIP ON BOARD |
| CAPACITY |
24 MILLION SHOTS / MONTH |
5.7 MILLION WIRES / MONTH |
| MACHINE CAPABILITY |
PCB SIZE : 460 X 360 mm (MAX) |
WIRE TYPE : GOLD (Au)
SIZE : 18mm – 38mm |
| MOUNTING CAPABILITIES |
FPC MOUNTING CAPABILITIES
BGA
FBGA : 0.45 X 0.80 mm pitch
PBGA : 0.36 X 0.65 mm pitch
QFP/QFN : 0.40 mm pitch |
WAFER SIZE : 4 -5 inches
DIE TYPE : 6 inches maximum |
| REWORK CAPABILITIES |
BGA RE-MOUNT
BGA RE-BAKE |
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| END PRODUCT |
LED BACKLIGHT
MEMORY CARD
PRINTER CARD
UPS UNIT
ESD TESTER |
REMOTE CONTROL RECEIVER
LED MODULE |
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| FINAL ASSEMBLY |
| SPACE |
750 SQ METERS |
| END PRODUCT |
UPS UNIT
ESD TESTER |
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| RELIABILITY TEST |
| ANALYSIS |
X-RAY MACHINE |
| RELIABILITY TEST |
THB TEST
THERMAL AGING TEST |
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